Full specification
Chipset: Intel XMM7560
Form factor: M.2 package (Type 3042-S3-B, 30x42mm)
Interface: PCIe Gen2 M.2 Key-B
Downlink: Up to 1 Gbps (LTE Cat 16)
Uplink: Up to 150 Mbps (LTE Cat 13)
LTE FDD Bands: 1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 21, 25, 26, 28, 29, 30, 32, 66
LTE TDD Bands: B38/39/40/41/42
UMTS Bands: 1, 2, 4, 5, 8
Operating Voltage: 3.135V~4.4V (Typical 3.3V)
Operating Temperature: -10°C to +55°C
Storage Temperature: -40°C to +85°C
TX Power - LTE: 23 dBm; WCDMA: 23.5 dBm
RX Sensitivity: -98 dBm to -102 dBm
eSIM support
Weight: Approximately 6.2 g
Physical Dimensions: 30×42×2.3 mm
Storage temperature: -40°C to +85°C
WWAN Antenna x4
